DEK NeoHorizon

Maximum flexibility for the intelligent factory

With its modular and scalable configuration options, the DEK NeoHorizon printer meets any process requirements and offers best flexibility for any production volumes

Flexible configurations, reliable processes

Your screen printer plays a critical role in your level of quality, productivity and yield.

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DEK NeoHorizon Platform

DEK provides the industry’s most powerful and flexible printing platforms.

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DEK NeoHorizon at a glance

Printing for any requirement: High-volume production or tiny lot sizes, frequent NPIs and product changeovers, pin-in-paste, super-small components and super-fine apertures, stepped stencils and even circuit boards with exotic substrates.
High-precision printing: Wet-print accuracy of up to ±20 µm @ 2 cpk
Fast operation: Core cycle time of up to 6.5 seconds
Back-to-back Dual-track setup: Higher print performance in dual-lane assembly line, as well as for frequent NPIs and product changeovers.
Optimal process stability: The machine’s stiff frame design with its high self-resonant frequency ensures longevity and a constant degree of accuracy.

	DEK NeoHorizon 03iX	DEK NeoHorizon 01iX
Machine alignment capability	> 2.0 cmk @ ±12.5 μm, (±6 sigma)	> 2.0 cmk @ ±12.5 μm, (±6 sigma)
System alignment capability	> 2.0 cmk @ ±20 μm, (±6 sigma)	> 2.0 cmk @ ±15 μm, (±6 sigma)
Wet print capability	> 2.0 cpk @ ±25 μm, (±6 Sigma)	> 2.0 cpk @ ±20 μm, (±6 Sigma)
Core Cycle Time (CCT)	8 seconds	6.5 seconds
Stencil Loading	Semi-Automatic	Automatic, including squeegee drip catcher
Maximum print area	510 mm (X) × 508.5 mm (Y)
Substrate size (max.)	620 mm (X) x 508.5 mm (Y)
Machine dimensions	2080 x 1500 x 1590 mm (L x W x H)

M2M communication interfaces: IPC-HERMES-9852, IPC-2591 CFX
Closed-loop connection to SPI systems: Advanced solder paste control with ProDEK and WORKS Optimization
Seamless Integration & Smart Connectivity: Customer MES via ASMPT WORKS software suite
Semiconductor options: SEMI S2/S8, SECS GEM

Typhoon stencil cleaning system: Flexible insert types and chamber lengths for optimal cleaning performance for every process and stencil
Material Management: The combination of DEK Paste Roll Height Monitor and DEK Automatic Paste Dispenser controls the paste quantity automatically
Multiple Alignment of Singulated Substrates (MASS): Multiple substrates are optically aligned at the same time
Grid-Lok: Universal board support system
HawkEye verification: Quickly verifies the printing results within the printer itself

Printing for any requirement: High-volume production or tiny lot sizes, frequent NPIs and product changeovers, pin-in-paste, super-small components and super-fine apertures, stepped stencils and even circuit boards with exotic substrates.
High-precision printing: Wet-print accuracy of up to ±20 µm @ 2 cpk
Fast operation: Core cycle time of up to 6.5 seconds
Back-to-back Dual-track setup: Higher print performance in dual-lane assembly line, as well as for frequent NPIs and product changeovers.
Optimal process stability: The machine’s stiff frame design with its high self-resonant frequency ensures longevity and a constant degree of accuracy.

	DEK NeoHorizon 03iX	DEK NeoHorizon 01iX
Machine alignment capability	> 2.0 cmk @ ±12.5 μm, (±6 sigma)	> 2.0 cmk @ ±12.5 μm, (±6 sigma)
System alignment capability	> 2.0 cmk @ ±20 μm, (±6 sigma)	> 2.0 cmk @ ±15 μm, (±6 sigma)
Wet print capability	> 2.0 cpk @ ±25 μm, (±6 Sigma)	> 2.0 cpk @ ±20 μm, (±6 Sigma)
Core Cycle Time (CCT)	8 seconds	6.5 seconds
Stencil Loading	Semi-Automatic	Automatic, including squeegee drip catcher
Maximum print area	510 mm (X) × 508.5 mm (Y)
Substrate size (max.)	620 mm (X) x 508.5 mm (Y)
Machine dimensions	2080 x 1500 x 1590 mm (L x W x H)

M2M communication interfaces: IPC-HERMES-9852, IPC-2591 CFX
Closed-loop connection to SPI systems: Advanced solder paste control with ProDEK and WORKS Optimization
Seamless Integration & Smart Connectivity: Customer MES via ASMPT WORKS software suite
Semiconductor options: SEMI S2/S8, SECS GEM

Typhoon stencil cleaning system: Flexible insert types and chamber lengths for optimal cleaning performance for every process and stencil
Material Management: The combination of DEK Paste Roll Height Monitor and DEK Automatic Paste Dispenser controls the paste quantity automatically
Multiple Alignment of Singulated Substrates (MASS): Multiple substrates are optically aligned at the same time
Grid-Lok: Universal board support system
HawkEye verification: Quickly verifies the printing results within the printer itself